Skin Effect & Frequency-Dependent¶
Frequency-dependent checks show how conductor behavior changes with microwave frequency, penetration depth, and kinetic inductance.
# |
Parameter |
Symbol / Unit |
Extraction Method |
Typical Q3D Value |
Ideal / Optimal |
Good Range |
Worst Case |
Why It Matters |
Key Design Note |
|---|---|---|---|---|---|---|---|---|---|
45 |
Skin Depth at 5 GHz |
delta_s / μm |
delta_s = √(2ρ/ωμ); Q3D skin-effect mode at frequency |
0.9 μm (Al at RT) |
0.5 – 2 μm |
0.5 – 3 μm |
> 5 μm (film < δ_s) |
If metal thickness < δ_s entire cross-section carries current and R_ac ≈ R_dc (good for thin films) |
Al at 4K is superconducting so delta_s concept replaced by London penetration depth λ_L: bulk Al ~16–55 nm; thin-film Al (50–200 nm film) typically 60–163 nm — increases as film thickness decreases |
46 |
AC/DC Resistance Ratio |
R_ac/R_dc |
Q3D frequency sweep; skin-effect solver comparison at DC vs 5 GHz |
1.0 – 1.05 (thin film) |
≈ 1.0 (thin film < δ_s) |
1.0 – 2.0 |
> 5 |
Thin-film qubits (t ~ 100–200 nm) operate below skin-depth limit so R_ac ≈ R_dc |
Normal-metal (Cu, Au) transmission lines show R_ac/R_dc ~ 3–5 at 5 GHz; use SC lines at mK |
47 |
Propagation Constant (gamma) |
α / dB/m, β / rad/m |
Q3D RLGC → gamma = √((R+jωL)(G+jωC)) |
α < 0.1 dB/m (SC CPW) |
α < 0.1 dB/m; β = ω√(L’C’) |
α 0.1 – 1 dB/m |
α > 10 dB/m |
α sets transmission line attenuation; β sets phase velocity; both from RLGC per unit length |
For long interconnects (> 10 mm) even 0.1 dB/m causes measurable signal loss; use SC Al/Nb |
48 |
Phase Velocity (v_ph) |
v_ph / ×10⁸ m/s |
Q3D RLGC → v_ph = ω/β = 1/√(L'C’) |
1.2 – 1.4 ×10⁸ m/s |
1.2 – 1.4 ×10⁸ m/s (CPW on Si) |
1.0 – 1.6 ×10⁸ m/s |
< 0.8 or > 2.0 |
Sets resonator physical length for target frequency; L = v_ph/(4f_r) for λ/4 resonator |
v_ph = c/√varepsilon_eff; on Si varepsilon_eff ≈ 6.3 → v_ph ≈ 1.19×10⁸ m/s; λ/4 at 7 GHz ≈ 4.25 mm |
49 |
Per-Unit-Length Resistance (R’) |
R’ / mΩ/mm |
Q3D frequency-dependent R matrix; RLGC R’ vs frequency |
< 0.1 mΩ/mm (SC Al) |
< 0.1 mΩ/mm |
0.1 – 2 mΩ/mm |
> 10 mΩ/mm |
Distributed series resistance determines attenuation α ≈ R’/(2Z₀); critical for long interconnects |
At 4K Al becomes superconducting: R’ → 0 below T_c; use R’ to identify non-SC regions |
50 |
Per-Unit-Length Inductance (L’) |
L’ / nH/mm |
Q3D RLGC magnetostatic solve |
0.3 – 0.5 nH/mm |
0.3 – 0.5 nH/mm (50 Ω CPW on Si) |
0.2 – 0.8 nH/mm |
< 0.1 or > 2 nH/mm |
Distributed inductance per mm; with C’ sets Z_0 = √(L’/C’) and v_ph = 1/√(L'C’) |
L’ includes both geometric and kinetic contributions; L'_kinetic small for Al (~0.01–0.05 nH/mm) |
51 |
Per-Unit-Length Capacitance (C’) |
C’ / pF/mm |
Q3D RLGC electrostatic solve |
0.1 – 0.2 pF/mm |
0.1 – 0.2 pF/mm (50 Ω CPW on Si) |
0.05 – 0.3 pF/mm |
< 0.02 or > 0.5 pF/mm |
Distributed capacitance per mm; with L’ sets Z_0 and varepsilon_eff; narrow gap increases C’ (lowers Z_0) |
Check: Z_0 = √(L’/C’) ≈ 50 Ω; v_ph = 1/√(L’×C’) ≈ 1.2×10⁸ m/s; these are consistency checks |