Conductance Matrix (G)¶
Conductance outputs describe leakage paths, dielectric loss, and shunt conductance that can reduce resonator Q and qubit coherence.
# |
Parameter |
Symbol / Unit |
Extraction Method |
Typical Q3D Value |
Ideal / Optimal |
Good Range |
Worst Case |
Why It Matters |
Key Design Note |
|---|---|---|---|---|---|---|---|---|---|
11 |
Self-Conductance (G_ii) |
G_ii / nS |
Q3D DC conductance solve |
< 0.1 nS |
< 0.1 nS (high-R substrate) |
0.1 – 1 nS |
> 10 nS |
Leakage current to ground through substrate limits resonator quality factor directly |
G_ii = 1/R_leak; appears as parallel resistance Q = ω_r C_r / G in resonator model |
12 |
Substrate Bulk Conductance |
G_bulk / nS |
Resistivity measurement + Q3D G matrix |
< 0.01 nS |
< 0.01 nS (> 10 kΩcm Si at 4K) |
0.01 – 0.5 nS |
> 5 nS |
Low-resistivity Si drastically degrades resonator Q; bulk conductance is the dominant channel |
Use high-resistivity Si (> 10 kΩcm) or sapphire; resistivity increases >100× when cooled to 4K (carrier freeze-out; magnitude is strongly doping-dependent) |
13 |
Surface / Interface Conductance |
G_surf / nS/μm |
Surface participation ratio + loss tangent fitting |
< 0.001 nS/μm |
< 0.001 nS/μm (clean passivated) |
0.001 – 0.05 nS/μm |
> 0.1 nS/μm |
Conductance along metal-air or metal-substrate interfaces is a major T₁ limitation via TLS |
Adsorbed water and organic residues increase G_surf; HF dip and N₂ purge before cooldown helps |
14 |
Mutual Conductance (G_ij) |
G_ij / pS |
Q3D off-diagonal G matrix extraction |
< 1 pS |
< 1 pS (isolated conductors) |
1 – 50 pS |
> 500 pS |
Leakage coupling between signal conductors via substrate surface conduction channels |
Non-zero G_ij in presence of surface water or conductive substrate; fixed by surface clean or guard rings |